From schematic to tested boards—quickly and correctly.
Capabilities
- High-speed digital, mixed-signal, RF, power delivery
- Impedance-controlled multilayer stackups, differential routing
- DFM/DFT reviews, BOM optimization, supply risk mitigation
- Proto builds, rework, functional & boundary-scan testing
Deliverables: Schematics, Gerbers, assembly files, 3D step, test reports, and a working prototype.
